Day 2 of Computex Taipei 2025 highlighted how AI is no longer just a buzzword. From Foxconn’s national-scale supercomputing ambitions to MediaTek’s data center-aligned silicon strategy and Qualcomm’s bid to lead in connectivity, the show floor echoed a clear message – AI’s real power lies in enabling ecosystems across cloud, edge and everything in between.

Foxconn: Transformer and Transformation

Taiwan Supercomputer

Foxconn, in partnership with NVIDIA and TSMC and with support from Taiwan’s government, is developing a phased AI supercomputing facility, starting at 20 MW and scaling to 100 MW. This initiative, run by Foxconn’s Big Innovation Company and coordinated through Taiwan’s National Science and Technology Council, is part of a broader move to position Taiwan as an AI hub for startups, researchers and enterprises. The project exemplifies Foxconn’s transformation from being a contract manufacturer to a national-scale digital infrastructure enabler.

‘3+3’ Strategy Execution with Deep AI Integration Across EVs, Health and Robotics: Chairman Young Liu reaffirmed Foxconn’s ‘3+3’ strategy, encompassing three key industries – EVs, Digital Health and Robotics – and three foundational technologies – AI, Semiconductors and Next-generation Communications. AI now runs horizontally across all business units, powering EV development with in-house chips, enhancing digital health with foundry-backed diagnostics, and enabling automation in robotics across global plants. These synergies position Foxconn as a vertically integrated tech enabler, not just a supplier.

AI-Powered Manufacturing and Mobility – 80% Automation and Smart City Push: Foxconn targets 80% automation across its manufacturing sites using AI, digital twins and cyber-physical systems, reducing human involvement to just 20%. This initiative dovetails with its ambitions related to smart city and mobility, digital infrastructure for ADAS, energy management, and connected vehicles. AI is the common thread here, enabling not only smarter factories but also more resilient and scalable urban mobility ecosystems.

From the floor – Liz Lee, Associate Director at Counterpoint: “Foxconn is evolving beyond hardware assembly into a national AI infrastructure leader and full-stack technology orchestrator. By aligning its ‘3+3’ diversification strategy with deep AI integration, from chip design to robotics to smart mobility, and leveraging government partnerships, Foxconn is building end-to-end capabilities that fuse manufacturing resilience with platform-scale intelligence. Its pragmatic approach to energy, automation, and digital ecosystems signals a structural shift in its long-term positioning, from the world’s factory to one of the world’s most strategic AI and tech enablers.”

Source: AFP

MediaTek’s Accelerating Forward Moves

Partnership with NVIDIA

A key announcement from MediaTek was its partnership with NVIDIA for NVLink Fusion and becoming one of the first adopters. MediaTek has rich expertise in ASIC design, and with NVLink’s strong ecosystem support, the company aims to develop custom AI silicon solutions that will serve the growing silicon demand of hyperscalers.

Apart from this, MediaTek’s strategic collaboration with NVIDIA has also led to the creation of the NVIDIA GB10 Grace Blackwell superchip for NVIDIA DGX Spark. NVIDIA’s deeper engagement was further underscored by CEO Jensen Huang’s appearance at MediaTek's keynote speech delivered by Dr Rick Tsai, where both executives talked about strong synergy between the two companies.

2nm Chip Development: MediaTek’s announcement that its first 2nm chip will be “taped out” in September is a significant achievement, highlighting its strengthening partnership with industry leaders like TSMC. Securing and advancing capacity in cutting-edge fabs is incredibly challenging, making this a major milestone in terms of being an early adopter of advanced nodes.

Hybrid Computing for Smart Homes: MediaTek has demonstrated a fully connected smart home vision by integrating computing and connectivity. MediaTek showcased a demo through the world's first 5G generative AI gateway that combines a 5G FWA (Fixed Wireless Access) platform with on-device generative AI capabilities. We believe the use cases are yet to evolve in this space, but we might have a killer use case by 2026.

Dimensity Auto Platform Enhancements: MediaTek showcased the flagship Dimensity Auto Cockpit C-X1 chipset, which integrates the latest generative AI models with AI acoustic technologies for a personalized virtual assistant service. This is one area where MediaTek is playing catch-up and likely aims to strike new partnerships with the Dimensity Auto Connect MT2739, featuring the world's first in-vehicle 5G DSDA 3Tx tech.

From the floor – Tarun Pathak, Research Director at Counterpoint: “MediaTek showed how it is continuing to forge strategic footholds across AI silicon, automotive and hybrid edge intelligence. The NVIDIA partnership on NVLink Fusion is especially notable as it will help the company tap into AI data center demand, driving its shift towards the data center and enterprise markets.”

Source: Counterpoint Research

Source: Counterpoint Research

Booth Tour: AI Servers Dominate the Show Floor

AI server systems took center stage across multiple booths, mirroring what was highlighted in NVIDIA’s keynote. Booths like Pegatron and Gigabyte, visited by Jensen Huang himself, drew the biggest crowds, while those focused on AI PCs, gaming, VR and robots saw noticeably lighter footfall.

The GB300 platform emerged as the undisputed star, reinforcing its market buzz and making prior concerns about delays irrelevant.

Another notable discussion point was cooling systems, as AI server infrastructure pushes thermal boundaries.

From the floor - MS Hwang, Research Director at Counterpoint: “Participants agree on the productivity edge of NVIDIA’s innovations, but practical daily AI use cases remain uncertain. This disconnect could persist for a few years as the consumer ecosystem catches up.”

Connectivity Update: Qualcomm’s FWA and Wi-Fi Push

Qualcomm announced its Dragonwing FWA Gen 4 Elite platform, billed as the world’s first of its kind. Powered by the x85 5G Modem-RF system and the Qualcomm 5G AI Suite, it delivers 30% faster AI inference and improved on-device network selection.

Other launches included the Dragonwing Npro A7 Elite platform for Wi-Fi networking and mixed reality, plus FastConnect 7700 and C7700, supporting 5.8Gbps peak speeds and ultra-low latency. These innovations target enterprise, industrial IoT and future connected vehicles.

From the floor - Zoey Hsu, Research Associate at Counterpoint: “Qualcomm is redefining the future of broadband and connected experiences across consumer, enterprise and industrial areas.”

Source Qualcomm